As a team of highly skilled IC Package Engineers, our mission is to develop and execute

packaging qualification plans and identify opportunities to optimize the packaging process

to improve production efficiency. Our success in providing world-class support is attributed

to our team’s wide range of capabilities and expertise.

  • Solid experience in semiconductor device assembly, package technology process assessment, selection and qualification, standardization, and optimization.
  • Highest commitment to meet or beat schedules according to client needs.
  • Flexibility, adaptability, and quick ramp-up time to learn new and/or changing project priorities, processes, and technologies.
  • Highly skilled in understanding a variety of packaging technologies and deployment solutions.
  • Setting of measurable and attainable daily/weekly targets according to the overall project goal.
  • Effective offshore collaboration through various means of communication.
  • Sharing of initiatives on process improvements through innovative solutions.
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